Touch sensing unit and display device including the same

ABSTRACT

A touch sensing unit includes first touch electrodes, a first touch signal line, and a second touch signal line. The first touch electrodes are disposed in a touch sensor area. The first touch signal line is electrically connected to some of the first touch electrodes arranged in a first column. The second touch signal line is electrically connected to some of the first touch electrodes arranged in a second column different from the first column. The second touch signal line includes a first bent portion bent at least once in an intersection region of the first touch signal line and the second touch signal line.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. patent application Ser. No.17/195,378, filed Mar. 8, 2021, which is a Continuation of U.S. patentapplication Ser. No. 16/551,227, filed Aug. 26, 2019, which issued asU.S. Pat. No. 10,942,609, which claims priority to and the benefit ofKorean Patent Application No. 10-2018-0141703, filed Nov. 16, 2018, eachof which is hereby incorporated by reference for all purposes as iffully set forth herein.

BACKGROUND Field

Embodiments generally relate to a touch sensing unit and a displaydevice including the same.

Discussion

A display device for displaying an image may be used for variouselectronic appliances for providing an image to a user, such as smartphones, tablet personal computers (PCs), digital cameras, notebookcomputers, navigators, televisions, etc. The display device may includea display panel for generating and displaying an image, as well asinclude various input devices. For instance, in the fields of smartphones and tablet PCs, a touch sensing unit for recognizing a touchinput (or interaction) has been used as an input device for a displaydevice. The touch sensing unit may determine whether a user's touch (ornear touch, e.g., hovering action) is input, and may determine (e.g.,calculate) the corresponding position as touch input coordinates.

The touch sensing unit may include first touch electrodes electricallyconnected in a first direction, second touch electrodes electricallyconnected in a second direction intersecting the first direction, firsttouch lines connected to the first touch electrodes, and second touchlines connected to the second touch electrodes. In this case, the firsttouch lines may be (or become) disconnected in an area where the firsttouch lines are formed at high density, and thus, the touch sensing unitmay be disabled.

The above information disclosed in this section is only forunderstanding the background of the inventive concepts, and, therefore,may contain information that does not form prior art.

SUMMARY

Some embodiments provide a touch sensing unit capable of preventing (orreducing the likelihood of) touch signal lines from being disconnectedeven when the touch signal lines are formed at high density.

Some embodiments provide a display device including a touch sensing unitcapable of preventing (or reducing the likelihood of) touch signal linesfrom being disconnected even when the touch signal lines are formed athigh density.

Additional aspects/features will be set forth in the detaileddescription which follows, and, in part, will be apparent from thedisclosure, or may be learned by practice of the inventive concepts.

According to some embodiments, a touch sensing unit includes first touchelectrodes, a first touch signal line, and a second touch signal line.The first touch electrodes are disposed in a touch sensor area. Thefirst touch signal line is electrically connected to some of the firsttouch electrodes arranged in a first column. The second touch signalline is electrically connected to some of the first touch electrodesarranged in a second column different from the first column. The secondtouch signal line includes a first bent portion bent at least once in anintersection region of the first touch signal line and the second touchsignal line.

According to some embodiments, a touch sensing unit includes first touchelectrodes, a first touch signal line, and a second touch signal line.The first touch electrodes are disposed in a touch sensor area. Thefirst touch signal line is electrically connected to first touchelectrodes arranged in a first column among the first touch electrodes.The second touch signal line is electrically connected to first touchelectrodes arranged in a second column among the first touch electrodes.The second column is different from the first column. The first touchsignal line includes a first connection line overlapping the secondtouch signal line in an intersection region of the first touch signalline and the second touch signal line.

According to some embodiments, a display device includes a display areaand a touch sensor area overlapping the display area. The display areaincludes pixels. The touch sensor area includes first touch electrodes,a first touch signal line, and a second touch signal line. The firsttouch electrodes are disposed in the touch sensor area. The first touchsignal line is electrically connected to some of the first touchelectrodes arranged in a first column. The second touch signal line iselectrically connected to some of the first touch electrodes arranged ina second column different from the first column. The second touch signalline includes a first bent portion bent at least once in an intersectionregion of the first touch signal line and the second touch signal line.

The foregoing general description and the following detailed descriptionare illustrative and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate embodiments of theinventive concepts, and, together with the description, serve to explainprinciples of the inventive concepts.

FIG. 1 is a perspective view of a display device according to someembodiments.

FIG. 2 is a plan view of a display device according to some embodiments.

FIG. 3 is an example of a cross-sectional view taken along sectionalline I-I′ of FIG. 2 according to some embodiments.

FIG. 4 is a plan view showing an example of the display unit of FIG. 3according to some embodiments.

FIG. 5 is a plan view showing an example of the touch sensing unit ofFIG. 3 according to some embodiments.

FIG. 6 is an enlarged plan view showing an example of the area A of FIG.5 according to some embodiments.

FIG. 7 is an example of a cross-sectional view taken along sectionalline II-II′ of FIG. 6 according to some embodiments.

FIG. 8 is an enlarged plan view showing an example of the area B of FIG.5 according to some embodiments.

FIG. 9 is an enlarged plan view showing an example of the area B-1 ofFIG. 8 according to some embodiments.

FIG. 10 is an example of a cross-sectional view taken along sectionalline and IV-IV′ of FIG. 9 according to some embodiments.

FIG. 11 is an enlarged plan view showing another example of the area B-1of FIG. 8 according to some embodiments.

FIG. 12 is an enlarged plan view showing an example of the area C ofFIG. 5 according to some embodiments.

FIG. 13 is an enlarged plan view showing an example of the area D ofFIG. 5 according to some embodiments.

FIG. 14 is an enlarged plan view showing an example of the area E ofFIG. 5 according to some embodiments.

FIG. 15 is an enlarged plan view showing an example of the area F ofFIG. 5 according to some embodiments.

FIG. 16 is an example of a cross-sectional view taken along sectionalline V-V′ of FIG. 13 , sectional line VI-VI′ of FIG. 14 , and sectionalline VII-VII′ of FIG. 15 according to some embodiments.

FIG. 17 is another example of a cross-sectional view taken alongsectional line II-II′ of FIG. 6 according to some embodiments.

FIG. 18 is an enlarged plan view showing another example of the area B-1of FIG. 8 according to some embodiments.

FIG. 19 is an example of a cross-sectional view taken along sectionalline VIII-VIII′ of FIG. 18 according to some embodiments.

FIG. 20 is another example of a cross-sectional view taken alongsectional line V-V′ of FIG. 13 , sectional line VI-VI′ of FIG. 14 , andsectional line VII-VII′ of FIG. 15 according to some embodiments.

FIG. 21 is a plan view showing an example of the touch sensing unit ofFIG. 5 according to some embodiments.

FIG. 22 is a plan view showing another example of the touch sensing unitof FIG. 5 according to some embodiments.

FIG. 23 is a plan view showing another example of the touch sensing unitof FIG. 5 according to some embodiments.

FIG. 24 is a perspective view of another display device according tosome embodiments.

FIG. 25 is a plan view of another display device according to someembodiments.

FIG. 26 is an example of a cross-sectional view taken along sectionalline IX-IX′ of FIG. 25 according to some embodiments.

FIG. 27 is a plan view showing an example of the display unit of FIG. 26according to some embodiments.

FIG. 28 is a plan view showing an example of the touch sensing unit ofFIG. 26 according to some embodiments.

DETAILED DESCRIPTION OF THE ILLUS PRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various embodiments. As used herein, the terms“embodiments” and “implementations” are used interchangeably and arenon-limiting examples employing one or more of the inventive conceptsdisclosed herein. It is apparent, however, that various embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various embodiments. Further, various embodiments may bedifferent, but do not have to be exclusive. For example, specificshapes, configurations, and characteristics of an embodiment may be usedor implemented in another embodiment without departing from theinventive concepts.

Unless otherwise specified, the illustrated embodiments are to beunderstood as providing illustrative features of varying detail of someembodiments. Therefore, unless otherwise specified, the features,components, modules, layers, films, panels, regions, aspects, etc.(hereinafter individually or collectively referred to as an “element” or“elements”), of the various illustrations may be otherwise combined,separated, interchanged, and/or rearranged without departing from theinventive concepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. As such, thesizes and relative sizes of the respective elements are not necessarilylimited to the sizes and relative sizes shown in the drawings. When anembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element, it may be directly on,connected to, or coupled to the other element or intervening elementsmay be present. When, however, an element is referred to as being“directly on,” “directly connected to,” or “directly coupled to” anotherelement, there are no intervening elements present. Other terms and/orphrases used to describe a relationship between elements should beinterpreted in a like fashion, e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” “on” versus “directlyon,” etc. Further, the term “connected” may refer to physical,electrical, and/or fluid connection. In addition, the X-axis, theY-axis, and the Z-axis are not limited to three axes of a rectangularcoordinate system, and may be interpreted in a broader sense. Forexample, the X-axis, the Y-axis, and the Z-axis may be perpendicular toone another, or may represent different directions that are notperpendicular to one another. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various elements, these elements should not be limited by theseterms. These terms are used to distinguish one element from anotherelement. Thus, a first element discussed below could be termed a secondelement without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one element's relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, theillustrative term “below” can encompass both an orientation of above andbelow. Furthermore, the apparatus may be otherwise oriented (e.g.,rotated 90 degrees or at other orientations), and, as such, thespatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various embodiments are described herein with reference to sectionalviews, isometric views, perspective views, plan views, and/or explodedillustrations that are schematic illustrations of idealized embodimentsand/or intermediate structures. As such, variations from the shapes ofthe illustrations as a result of, for example, manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments disclosedherein should not be construed as limited to the particular illustratedshapes of regions, but are to include deviations in shapes that resultfrom, for instance, manufacturing. To this end, regions illustrated inthe drawings may be schematic in nature and shapes of these regions maynot reflect the actual shapes of regions of a device, and, as such, arenot intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

As customary in the field, some embodiments are described andillustrated in the accompanying drawings in terms of functional blocks,units, and/or modules. Those skilled in the art will appreciate thatthese blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some embodiments may be physically separated into two or moreinteracting and discrete blocks, units, and/or modules without departingfrom the inventive concepts. Further, the blocks, units, and/or modulesof some embodiments may be physically combined into more complex blocks,units, and/or modules without departing from the inventive concepts.

Hereinafter, various embodiments will be explained in detail withreference to the accompanying drawings.

FIG. 1 is a perspective view of a display device according to someembodiments. FIG. 2 is a plan view of a display device according to someembodiments.

For the purposes of this disclosure, the terms “on,” “over,” “top,”“upper side,” and “upper surface” refer to a direction in which a touchsensing unit (or touch sensing structure) 500 is disposed, that is, aZ-axis direction, with respect to a display panel 100, and the terms“beneath,” “under,” “bottom,” “lower side,” and “lower surface” refer toa direction in which the display panel 100 is disposed, that is, adirection opposite to the Z-axis direction, with respect to the touchsensing unit 500. Further, the terms “left,” “right,” “upper,” and“lower” refer to directions when the display panel 100 is viewed from aplane, e.g., a plane parallel to a plane defined by the X-axis directionand the Y-axis direction. For example, the “left” refers to a directionopposite the X-axis direction, the “right” refers to the X-axisdirection, the “upper” refers to the Y-axis direction, and the “lower”refers to a direction opposite the Y-axis direction.

Referring to FIGS. 1 and 2 , a display device 10 is a device fordisplaying a moving image and/or a still image. The display device 10may be used as a display screen for various products, such astelevisions, notebooks, monitors, billboards, internet of thingsdevices, etc., as well as portable electronic appliances, such as mobilephones, smart phones, tablet personal computers (PCs), smart watches,watch phones, mobile communication terminals, electronic notebooks,electronic books, portable multimedia players (PMPs), navigators,ultra-mobile PCs (UMPs), and the like. The display device 10 may be anyone of an organic light emitting display device, a liquid crystaldisplay device, a plasma display device, a field emission displaydevice, an electrophoretic display device, an electrowetting displaydevice, a quantum dot emission display device, and a micro lightemitting diode (LED) display device. Hereinafter, the display device 10will be described assuming that the display device 10 is an organiclight emitting display device, but embodiments are not limited thereto.

The display device 10 according to some embodiments includes a displaypanel 100, a display driving circuit 200, a display circuit board 300, atouch driving circuit 400, a touch circuit board 410, and a touchsensing unit 500.

The display panel 100 may have a rectangular planar shape having shortsides in the first direction (X-axis direction) and long sides in thesecond direction (Y-axis direction). The corner where the short side inthe first direction (X-axis direction) meets the long side in the seconddirection (Y-axis direction) may be formed to have a round shape of apredetermined curvature, a right angle shape, or some other geometricconfiguration. The planar shape of the display panel 100 is not limitedto a rectangular shape, and may be formed in another polygonal shape,circular shape, or elliptical shape.

The display panel 100 may be formed to be flat, but is not limitedthereto, and may include a curved portion formed at, for instance, leftand right ends. In this case, the curved portion may have a constantcurvature or a variable curvature. Further, the display panel 100 may beformed to be flexible such that it is (or can be) intentionally bent,unbent, warped, unwarped, folded, unfolded, rolled, and/or unrolled.

As will become more apparent below, the display panel 100 may includepixels disposed in a display area and displaying an image, and displayelectrode pads disposed in a non-display area, which may be outside(e.g., around) the display area. The display electrode pads may beformed on the display panel 100 at one side edge of the display panel100 and electrically connected to the display circuit board 300. Moredetails of the display panel 100 will be described later with referenceto FIGS. 3 and 4 .

The display driving circuit 200 outputs signals and voltages for drivingthe display panel 100. For example, the display driving circuit 200 maysupply data voltages to data lines. Further, the display driving circuit200 may supply power supply voltages to power supply lines and maysupply scan control signals to a scan driving unit. The display drivingcircuit 200 may be formed of an integrated circuit (IC) and attachedonto the display panel 100 by a chip-on-glass (COG) method, achip-on-plastic (COP) method, or an ultrasonic bonding method; however,embodiments are not limited thereto. The display driving circuit 200 maybe attached onto an exposed portion of the display panel 100 withoutbeing covered by the touch sensing unit 500. Alternatively, the displaydriving circuit 200 may be mounted on the display circuit board 300 orany other suitable component of the display device 10.

The display circuit board 300 may be attached onto the display electrodepads of the display panel 100 using an anisotropic conductive film.Thus, the lead lines of the display circuit board 300 may beelectrically connected to the display electrode pads of the displaypanel 100. The display circuit board 300 may be a flexible printedcircuit board, a printed circuit board, or a flexible film, such as achip-on film.

The touch sensing unit 500 may be disposed on the display panel 100. Thetouch sensing unit 500 may have a rectangular planar shape having shortsides in the first direction (X-axis direction) and long sides in thesecond direction (Y-axis direction). The corner where the short side inthe first direction (X-axis direction) meets the long side in the seconddirection (Y-axis direction) may be formed to have a round shape of apredetermined curvature, a right angle shape, or any other suitablegeometric configuration. The planar shape of the touch sensing unit 500is not limited to a rectangular shape, and may be formed in anotherpolygonal shape, circular shape, or elliptical shape. In someembodiments, the planar shape of the touch sensing unit 500 may besimilar to the planar shape of the display panel 100.

The touch sensing unit 500 may be formed to be flat, but is not limitedthereto, and may include a curved portion formed at, for instance, leftand right ends. In this case, the curved portion may have a constantcurvature or a variable curvature. Further, the touch sensing unit 500,like the display panel 100, may be formed to be flexible such that it is(or can be) intentionally bent, unbent, warped, unwarped, folded,unfolded, rolled, and/or unrolled.

As will become more apparent below, the touch sensing unit 500 mayinclude touch electrodes disposed in a touch sensor area and sensing auser's touch, and touch electrode pads disposed in a touch peripheralarea, which may be outside (e.g., around) the touch sensor area. Thetouch electrode pads may be formed on the touch sensing unit 500 at oneside edge of the touch sensing unit 500 and electrically connected tothe touch circuit board 410.

Details of the touch sensing unit 500 will be described later withreference to FIGS. 3 and 5 . Although it is illustrated in FIGS. 1 and 2that the touch sensing unit 500 is a separate touch panel that isseparated from the display panel 100, embodiments are not limitedthereto. For instance, as shown in at least FIGS. 25 and 26 , the touchsensing unit 500 may be formed directly on a thin film encapsulationlayer of the display panel 100. Details thereof will be described laterwith reference to FIGS. 25 to 28 .

The touch circuit board 410 may be attached onto the touch electrodepads of the touch sensing unit 500 using an anisotropic conductive film.Accordingly, the lead lines of the touch circuit board 410 may beelectrically connected to the touch electrode pads of the touch sensingunit 500. The touch circuit board 410 may be a flexible printed circuitboard, a printed circuit board, or a flexible film, such as a chip-onfilm.

The touch driving circuit 400 may be connected to the touch electrodesof the touch sensing unit 500. The touch driving circuit 400 appliestouch driving signals to the touch electrodes of the touch sensing unit500 and measures capacitance values of the touch electrodes. The touchdriving signal may be a signal having a plurality of driving pulses. Thetouch driving circuit 400 may determine whether or not a touch input (orinteraction) is performed depending on the capacitance values, and mayalso determine (e.g., calculate) touch coordinates at which a touchinteraction is input. The touch driving circuit 400 may be formed of anintegrated circuit (IC) and mounted on the touch circuit board 410.

FIG. 3 is an example of a cross-sectional view taken along sectionalline I-I′ of FIG. 2 according to some embodiments.

Referring to FIG. 3 , the display device 10 may include a display unitDU, a touch sensing unit TDU, and an adhesive member SEAL for bondingthe display unit DU and the touch sensing unit TDU.

The display unit DU may include a first substrate SUB1, a thin filmtransistor layer TFTL, and a light emitting element layer EML.

The first substrate SUB1 may be a rigid substrate or may be a flexiblesubstrate capable of bending, folding, rolling, and/or the like. Thefirst substrate SUB1 may be made of an insulating material, such asglass, quartz, and/or a polymer resin. Examples of the polymer resin mayinclude polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR),polyetherimide (PEI), polyethylene naphthalate (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate,polyimide (PI), polycarbonate (PC), cellulose triacetate (CTA or TAC),cellulose acetate propionate (CAP), and/or combinations thereof.Alternatively (or additionally), the first substrate SUB1 may include ametal material.

The thin film transistor layer TFTL may be disposed on the firstsubstrate SUB1. As will become more apparent below, the thin filmtransistor layer TFTL may be provided with not only thin filmtransistors of each pixel, but also scan lines, data lines, power supplylines, scan control lines, data connection lines for connecting thedisplay driving circuit 200 and data lines, and pad connection lines forconnecting the display driving circuit 200 and display electrode pads.Each of the thin film transistors may include a gate electrode, asemiconductor layer, a source electrode, and a drain electrode. When ascan driving unit 110 is formed in a non-display area NDA of the displaypanel 100 as shown in FIG. 4 , the scan driving unit 110 may includethin film transistors.

The thin film transistor layer TFTL may be disposed in the display areaDA and the non-display area NDA. For example, thin film transistors,scan lines, data lines, and power supply lines of each pixel of the thinfilm transistor layer TFTL may be disposed in the display area DA.Further, scan control lines, data connection lines, and pad connectionlines of the thin film transistor layer TFTL may be disposed in thenon-display area NDA.

The light emitting element layer EML may be disposed on the thin filmtransistor layer TFTL. As will become more apparent below, the lightemitting element layer EML may include pixels, each of which may includea first electrode, a light emitting layer, and a second electrodesequentially laminated, and a pixel defining film defining the pixels.The pixels of the light emitting element layer EML may be disposed inthe display area DA.

The light emitting layer may be an electroluminescent layer, such asorganic light emitting layer including an organic material. In thiscase, the light emitting layer may include a hole transporting layer, anorganic light emitting layer, and an electron transporting layer. When apredetermined voltage is applied to the first electrode through the thinfilm transistor of the thin film transistor layer TFTL and a cathodevoltage is applied to the second electrode, holes and electrons aretransferred to the organic light emitting layer through the holetransporting layer and the electron transporting layer, respectively,and are combined with each other to emit light. In this case, the firstelectrode may be an anode electrode, and the second electrode may be acathode electrode, but embodiments are not limited to such aconfiguration.

The touch sensing unit TDU may include a second substrate SUB2 and atouch sensor layer TSL.

The second substrate SUB2 may be a rigid substrate or may be a flexiblesubstrate capable of bending, folding, rolling, and/or the like. Thesecond substrate SUB2 may be made of an insulating material, such asglass, quartz, and/or a polymer resin. Examples of the polymer resin mayinclude polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR),polyetherimide (PEI), polyethylene naphthalate (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyallylate,polyimide (PI), polycarbonate (PC), cellulose triacetate (CTA or TAC),cellulose acetate propionate (CAP), and/or combinations thereof.Alternatively (or additionally), the second substrate SUB2 may include ametal material. Further, the second substrate SUB2 may serve as anencapsulation substrate for encapsulating the light emitting elementlayer EML.

The touch sensor layer TSL may be disposed on the second substrate SUB2.The touch sensor layer TSL may include touch electrodes for sensing auser's touch by a capacitance method, touch electrode pads, and touchsignal lines for connecting the touch electrode pads and the touchelectrodes. For example, the touch sensor layer TSL may sense a user'stouch by a self-capacitance method and/or a mutual capacitance method,but embodiments are not limited thereto.

As shown in FIGS. 5 and 6 , the touch electrodes of the touch sensorlayer TSL may be disposed in a touch sensor area TSA overlapping thedisplay area DA. The touch signal lines and touch electrode pads of thetouch sensor layer TSL may be disposed in a touch peripheral area TPAoverlapping the non-display area NDA. The touch peripheral area TPA maybe disposed around the touch sensor area TSA.

Although not shown, a polarizing film and a cover window may beadditionally disposed on the touch sensor layer TSL. In this case, thepolarizing film may be disposed on the touch sensor layer TSL, and thecover window may be attached onto the polarizing film by a transparentadhesive member such that the polarizing film is between the coverwindow and the touch sensing layer TSL.

The adhesive member SEAL may attach the first substrate SUB1 of thedisplay unit DU to the second substrate SUB2 of the touch sensing unitTDU. The adhesive member SEAL may be a frit adhesive layer, anultraviolet-curable resin layer, or a thermosetting resin layer, butembodiments are not limited thereto.

Although it is illustrated in FIG. 3 that an empty space is formedbetween the light emitting element layer EML and the second substrateSUB2, embodiments are not limited thereto. For example, a filling filmmay be disposed between the light emitting element layer EML and thesecond substrate SUB2. The filling film may be an epoxy filling film ora silicon filling film.

FIG. 4 is a plan view showing an example of the display unit of FIG. 3according to some embodiments. For convenience of explanation, FIG. 4shows pixels P of the display unit DU, scan lines SL, data lines DL, apower supply line PL, scan control lines SCL, a scan driving unit 110, adisplay driving circuit 200, display electrode pads DP, data connectionlines DLL, and pad connection lines PLL.

Referring to FIG. 4 , the display panel 100 may include a display areaDA where pixels P are formed to display an image, and a non-display areaNDA that may be a peripheral area of the display area DA. Thenon-display area NDA may be defined as an area from the outside of thedisplay area DA to the edge of the display panel 100.

The scan lines SL, the data lines DL, the power supply line PL, and thepixels P may be disposed in the display area DA. The scan lines SL maybe formed in parallel in a first direction (X- axis direction), and thedata lines DL may be formed in parallel in a second direction (Y-axisdirection) intersecting the first direction (X-axis direction). Thepower supply line PL may include at least one line formed in parallelwith the data lines DL in the second direction (Y-axis direction) and aplurality of lines branched from the at least one line in the firstdirection (X- axis direction).

Each of the pixels P may be connected to at least one of the scan linesSL, at least one of the data lines DL, and the power supply line PL.Although not shown, each of the pixels P may include thin filmtransistors including a driving transistor and at least one switchingtransistor, an organic light emitting diode, and a capacitor. Each ofthe pixels P may receive a data voltage of (or from) a data line DL whena scan signal is applied from a scan line SL, and may supply a drivecurrent to the organic light emitting diode in response to a datavoltage applied to a gate electrode to emit light.

The scan driving unit (or circuit) 110, the display driving circuit 200,the scan control lines SCL, the data connection lines DLL, and the padconnection lines PLL may be disposed in the non-display area NDA.

The scan driving unit 110 is connected to the display driving circuit200 through at least one scan control line SCL. Therefore, the scandriving unit 110 may receive a scan control signal of the displaydriving circuit 200. The scan driving unit 110 generates scan signals inresponse to the scan control signal and supplies the scan signals to thescan lines SL.

Although it is illustrated in FIG. 4 that the scan driving unit 110 isformed in the non-is display area NDA outside one side of the displayarea DA, embodiments are not limited thereto. For example, the scandriving unit 110 may be formed in the non-display area NDA outside bothsides of the display area DA, or any other suitable location.

The display driving circuit 200 is connected to the display electrodepads DP of a display pad area DPA through the pad connection lines PLLto receive digital video data and timing signals. The display drivingcircuit 200 converts the digital video data into analogpositive/negative data voltages, and supplies the analogpositive/negative data voltages to the data lines DL through the dataconnection lines DLL. Further, the display driving circuit 200 generatesand supplies scan control signals for controlling the scan driving unit110 through the scan control line SCL. Pixels P to which data voltagesare to be supplied may be selected, and data voltages may be supplied tothe selected pixels P. The display driving circuit 200 may be formed ofan integrated circuit (IC), and may be attached onto the substrate firstsubstrate SUB1 by a chip-on-glass (COG) method, a chip-on-plastic (COP)method, an ultrasonic bonding method, or any other suitable method.

FIG. 5 is a plan view showing an example of the touch sensing unit ofFIG. 3 according to some embodiments. FIG. 6 is an enlarged plan viewshowing an example of the area A of FIG. 5 according to someembodiments.

Referring to FIG. 5 , the touch sensing unit TDU includes a touch sensorarea TSA for sensing a user's touch and a touch peripheral area TPAdisposed around the touch sensor area TSA. The touch sensor area TSA mayoverlap the display area DA of the display unit DU, and the touchperipheral area TPA may overlap the non-display area NDA of the displayunit DU.

The touch sensor area TSA may include a first touch sensor area TSA1, asecond touch sensor area TSA2, and a third touch sensor area TSA3. Thefirst touch sensor area TSA1 may have a rectangular shape in a planview. The first touch sensor area TSA1 may occupy most of the area ofthe touch sensor area TSA.

The second touch sensor area TSA2 and the third touch sensor area TSA3may protrude from one side of the first touch sensor area TSA1. Thesecond touch sensor area TSA2 may protrude from one edge of one side ofthe first touch sensor area TSA1, and the third touch sensor area TSA3may protrude from the other edge of one side of the first touch sensorarea TSA1. The touch sensor area TSA may further include a recessed areaRA having a shape in which the center of one side thereof is recessed.The recessed area RA may be disposed between the second touch sensorarea TSA2 and the third touch sensor area TSA3.

A third connection line CL3 for connecting some of second touch signallines TL21 to TL2 p (where “p” is a positive integer greater than orequal to two) with a second touch electrode RE of the second touchsensor area TSA2 and a second touch electrode RE of the third touchsensor area TSA3 may be disposed in the recessed area RA. Thus, some ofthe second touch signal lines TL21 to TL2 p may intersect the thirdconnection line CL3 in the area C of the recessed area RA. Details ofthe area C will be described later with reference to FIG. 12 .

Further, some of the second touch signal lines TL21 to TL2 p aredisposed in the recessed area RA, and thus, an empty area EA may bedisposed outside one side of the recessed area RA in the seconddirection (Y-axis direction). When the display device 10 is implementedas a mobile phone, a smart phone, or a table personal computer (tablePC), one or more electronic components (e.g., a camera device, aproximity sensor device, a luminance sensor device, an iris recognitionsensor device, and/or the like), may be disposed to overlap the emptyarea EA. In this manner, a separate bezel region for accommodating thecamera device, proximity sensor device, luminance sensor device, irisrecognition sensor device, etc., of the mobile phone, smart phone, ortable PC may be omitted. Therefore, a bezel region may be greatlyreduced on one side of a mobile phone, a smart phone, a tablet PC, etc.

Further, the second substrate SUB2 may be removed from (or in) an areaoverlapping the empty area EA. In this case, the first substrate SUB1,thin film transistor layer TFTL and light emitting element layer EML ofthe display unit DU may also be removed from an area overlapping theempty area EA.

The first touch electrodes TE and the second touch electrodes RE may bedisposed in the touch sensor area TSA. The first touch electrodes TE maybe spaced apart from the second touch electrodes RE. The first touchelectrodes TE may be arranged in a plurality of columns in the seconddirection (Y-axis direction), and the second touch electrodes RE may bearranged in a plurality of rows in the first direction (X-axisdirection). The first touch electrodes TE arranged in the plurality ofcolumns in the second direction (Y-axis direction) may be electricallyconnected to each other. Further, the second touch electrodes REarranged in the plurality of rows in the first direction (X-axisdirection) may be electrically connected to each other via connectionportions CP (see FIG. 6 ).

The first touch electrodes TE and the second touch electrodes RE may bedisposed in all the first touch sensor area TSA1, the second touchsensor area TSA2, and the third touch sensor area TSA3. The first touchelectrodes TE and second touch electrodes RE arranged in the first touchsensor area TSA1 may be formed in a diamond shape or a triangle shape ina plan view. For instance, the first touch electrodes TE and secondtouch electrodes RE arranged at the edge of the first touch sensor areaTSA1 may be formed in a triangle shape in a plan view, and the otherfirst touch electrodes TE and second touch electrodes RE may be formedin a diamond shape in a plan view. In each of the second touch sensorarea TSA2 and the third touch sensor area TSA3, at least one first touchelectrode TE and at least one second touch electrode RE may have anirregular shape. Further, to prevent (or at least reduce) the occurrenceof a moire phenomenon due to the first touch electrodes TE and thesecond touch electrodes RE when viewing an image of the display device10, the first touch electrodes TE and the second touch electrodes RE mayhave concave and convex sides in a plan view. The planar shape of thefirst touch electrodes TE and second touch electrodes RE disposed in thefirst touch sensor area TSA1 is not limited to that shown in FIG. 5 .

To prevent the first touch electrodes TE and the second touch electrodesRE from being shorted to each other in their intersection regions, thefirst touch electrodes TE adjacent to each other in the second direction(Y-axis direction) may be electrically connected through at least oneconnection electrode CE. In this case, the first touch electrodes TE andthe second touch electrodes RE may be arranged on one layer, and theconnection electrode CE may be disposed on (or in) a different layerfrom the first touch electrodes TE and the second touch electrodes RE.Accordingly, the first touch electrodes TE electrically connected in thesecond direction (Y-axis direction) may be electrically insulated fromthe second touch electrodes RE electrically connected in the firstdirection (X-axis direction).

First touch signal lines TL11 to TL1 p (where “p” is a positive integerof 2 or more), second touch signal lines TL21 to TL2 p, third touchsignal lines RL1 to RLq (where “q” is a positive integer of 2 or more),and touch electrode pads TP may be disposed in the touch peripheral areaTPA.

One end of the first touch signal lines TL11 to TL 1 p may be connectedto the first touch electrodes TE disposed on the first side of the touchsensor area TSA. Among four sides of the touch sensor area TSA, thefirst side of the touch sensor area TSA may be a side closest to thetouch pad area TDA where the touch electrode pads TP are disposed. Theother end of the first touch signal lines TL11 to TL1 p may be connectedto some of the touch electrode pads TP of the touch pad area TDA. Thatis, the first touch signal lines TL11 to TL1 p serve to connect thefirst touch electrodes TE disposed on the first side of the touch sensorarea TSA to some of the touch electrode pads TP of the touch pad areaTDA.

For example, as shown in FIG. 5 , the 1-1th touch signal line TL11 maybe electrically connected to the first touch electrodes TE arranged inthe first column of the touch sensor area TSA, and the 1-2th touchsignal line TL12 may be electrically connected to the first touchelectrodes TE arranged in the second column of the touch sensor areaTSA. Further, the 1-(p-1)th touch signal line TL1(p-1) may beelectrically connected to the first touch electrodes TE arranged in thep-1th column of the touch sensor area TSA, and the 1-pth touch signalline TL1 p may be electrically connected to the first touch electrodesTE arranged in the pth column of the touch sensor area TSA. In thiscase, the first column of the touch sensor area TSA is a column disposedat the leftmost side of the touch sensor area TSA, and the pth column ofthe touch sensor area TSA is a column disposed at the rightmost side ofthe touch sensor area TSA.

One end of the second touch signal lines TL21 to TL2 p may be connectedto the first touch electrodes TE disposed on the second side of thetouch sensor area TSA. The second side of the touch sensor area TSA,which is a side opposite to the first side of the touch sensor area TSA,may be a side where the recessed area RA is formed. The other end of thesecond touch signal lines TL21 to TL2 p may be connected to others ofthe touch electrode pads TP of the touch pad area TDA. That is, thesecond touch signal lines TL21 to TL2 p serve to connect the first touchelectrodes TE disposed on the second side of the touch sensor area TSAto others of the touch electrode pads TP of the touch pad area TDA.

For example, as shown in FIG. 5 , the 2-1th touch signal line TL21 maybe electrically connected to the first touch electrodes TE arranged inthe first column of the touch sensor area TSA, and the 2-2th touchsignal line TL22 may be electrically connected to the first touchelectrodes TE arranged in the second column of the touch sensor areaTSA. Further, the 2-(p-1)th touch signal line TL2(p-1) may beelectrically connected to the first touch electrodes TE arranged in thep-1th column of the touch sensor area TSA, and the 2-pth touch signalline TL2 p may be electrically connected to the first touch electrodesTE arranged in the pth column of the touch sensor area TSA.

The second touch signal lines TL21 to TL2 p may be connected to thefirst touch electrodes TE arranged on the second side of the touchsensor area TSA via the first outside and fourth outside of the touchsensor area TSA. The second touch signal lines TL21 to TL2 p may bebranched from the first touch signal lines TL11 to TL1 p, and thus, someof the first touch signal lines TL11 to TL1 p may intersect some of thesecond touch signal lines TL21 to TL2 p in the area B. The area B may bedisposed between the touch pad area TDA and the first side of the touchsensor area TSA. Details of the area B will be described in more detailwith reference to FIGS. 8, 9, and 10 .

For example, as shown in FIG. 5 , the 2-1th touch signal line TL21 maybe branched from the 1-1th touch signal line TL11, and the 2-2th touchsignal line TL22 may be branched from the 2-1th touch signal line TL21.The 2-(p-1) th touch signal line TL2(p-1) may be branched from the1-(p-1)th touch signal line TL1(p-1), and the 2-pth touch signal lineTL2 p may be branched from the 1-pth touch signal line TL1 p.

One end of the third touch signal lines TL31 to TL3 q may be connectedto the second touch electrodes RE disposed on the third side of thetouch sensor area TSA. The third side of the touch sensor area TSA maybe a side opposite to the fourth side of the touch sensor area TSA. Theother end of the third touch signal lines TL31 to TL3 q may be connectedto others of the touch electrode pads TP of the touch pad area TDA. Thatis, the third touch signal lines TL31 to TL3 q serve to connect thesecond touch electrodes RE disposed on the third side of the touchsensor area TSA to others of the touch electrode pads TP of the touchpad area TDA.

For example, as shown in FIG. 5 , the 3-1th touch signal line RL1 may beelectrically connected to the second touch electrodes RE arranged in thefirst row of the touch sensor area TSA, the 3-2th touch signal line RL2may be electrically connected to the second touch electrodes RE arrangedin the second row of the touch sensor area TSA, and the 3-3th touchsignal line RL3 may be electrically connected to the second touchelectrodes RE arranged in the third row of the touch sensor area TSA.Further, the 3-(q-2)th touch signal line RLq-2 may be electricallyconnected to the second touch electrodes RE arranged in the q-2th row ofthe touch sensor area TSA, the 3-(q-1)th touch signal line RLq-1 may beelectrically connected to the second touch electrodes RE arranged in theq-1th row of the touch sensor area TSA, and the 3-qth touch signal lineRLq may be electrically connected to the second touch electrodes REarranged in the qth row of the touch sensor area TSA.

The touch electrode pads TP may be disposed on one side of the secondsubstrate SUB2. The touch circuit board 410 may be attached onto touchelectrode pads TP using an anisotropic conductive film. Thus, the touchelectrode pads TP may be electrically connected to the touch circuitboard 410.

As previously mentioned, the first touch electrodes TE and the secondtouch electrodes RE may be driven by a mutual capacitance method or aself-capacitance method.

When the first touch electrodes TE and the second touch electrodes REare driven by a mutual capacitance method, touch driving signals aresupplied to the first touch electrodes TE through the first touch signallines TL11 to T11 p and the second touch signal lines TL21 to TL2 p,thereby charging mutual capacitances formed in the intersection regionsof the first touch electrodes TE and the second touch electrodes RE.Then, charge change amounts of the mutual capacitances are measuredthrough the second touch electrodes RE, and whether a touch input isperformed is determined according to the charge change amounts of themutual capacitances. The touch driving signal may be a signal having aplurality of touch driving pulses.

When the first touch electrodes TE and the second touch electrodes REare driven by a self-capacitance method, touch driving signals aresupplied to the first touch electrodes TE and the second touchelectrodes RE through the first touch signal lines TL11 to TL1 p, thesecond touch signal lines TL21 to TL2 p, and the third touch signallines RL1 to RLq, thereby charging self-capacitances of the first touchelectrodes TE and the second touch electrodes RE. Then, charge changeamounts of the self-capacitances are measured through the first touchsignal lines TL11 to TL1 p, the second touch signal lines TL21 to TL2 p,and the third touch signal lines RL1 to RLq, and whether a touch inputis performed is determined according to the charge change amounts ofself-capacitances.

Hereinafter, for convenience of explanation, a description will bemainly be made with the assumption that the first touch electrodes TEand the second touch electrodes RE are driven by a mutual capacitancemethod in which a plurality of touch driving pulses are applied to thefirst touch electrodes TE and the charge change amounts of mutualcapacitances are measured through the third touch signal lines RL1 toRLq connected to the second touch electrodes RE. In this case, the firsttouch electrodes TE may function as touch driving electrodes, the secondtouch electrodes RE may function as touch sensing electrodes, the firsttouch signal lines TL11 to TL1 p and the second touch signal lines TL21to TL2 p may function as touch driving lines, and the third touch signallines RL1 to RLq may function as touch sensing lines.

Further, a first guard line GL1, a second guard line GL2, a third guardline GL3, a first ground line GRL1, and a second ground line GRL2 may bearranged in the touch peripheral area TPA.

The first guard line GL1 may be disposed outside the 3-qth touch signalline RLq disposed at the outermost of the third touch signal lines RL1to RLq. Further, the first ground line GRL1 may be disposed outside thefirst guard line GL1. That is, since the first guard line GL1 isdisposed between the first ground line GRL1 and the 3-qth touch signalline RLq disposed at the outermost of the third touch signal lines RL1to RLq, the first guard line GL1 may serve to minimize the influence ofthe voltage change of the first ground line GRL1 on the 3-q touch signalline RLq. One end of the first guard line GL1 and one end of the firstground line GRL1 may be connected to the rightmost touch electrode padsTP.

The second guard line GL2 may be disposed between the 1-pth touch signalline TL1 p and the 3-1th touch signal line RL1 disposed at the innermostof the third touch signal lines RL1 to RLq. Thus, the second guard lineGL2 may serve to minimize the mutual influence between the 3-1th touchsignal line RL1 and the 1-pth touch signal line TL1 p. One end of thesecond guard line GL2 may be connected to the touch electrode pads TP.

The third guard line GL3 may be disposed between the 1-1th touch signalline TL11 and the 2-1th touch signal line TL21 disposed at the innermostof the second touch signal lines TL21 to TL2 p. Thus, the third guardline GL3 may serve to minimize the mutual influence between the 1-1thtouch signal line TL11 and the 2-1th touch signal line TL21. One end ofthe third guard line GL3 may be connected to the touch electrode padsTP.

The fourth guard line GL4 may be disposed outside the 2-pth touch signalline TL2 p disposed at the outermost of the second touch signal linesTL21 to TL2 p. Further, the second ground line GRL2 may be disposedoutside the fourth guard line GL4. Since the fourth guard line GL4 isdisposed between the second ground line GRL2 and the 2-pth touch signalline TL2 p disposed at the outermost of the second touch signal linesTL21 to TL2 p, the fourth guard line GL4 may serve to minimize theinfluence of the voltage change of the second ground line GRL2 on the2-p touch signal line TL2 p. One end of the fourth guard line GL4 andone end of the second ground line GRL2 may be connected to the leftmosttouch electrode pads TP.

The first ground line GRL1 is disposed at the outermost from the rightside of the touch sensing unit 500. The second ground line GRL2 isdisposed at the outermost from the lower side, left side, and upper sideof the touch sensing unit 500. A ground voltage is applied to the firstground line GRL1 and the second ground line GRL2. Thus, when staticelectricity is applied from the outside, the static electricity may bedischarged to the first ground line GRL1 and the second ground lineGRL2.

Meanwhile, when the first touch electrodes TE and the second touchelectrodes RE are driven by a mutual capacitance method, it ispreferable that a ground voltage is applied to the first guard line GL1,the second guard line GL2, the third guard line GL3, and the fourthguard line GL4.

According to some embodiments shown in FIG. 5 , the second touch signallines TL21 to TL2 p may be branched from the first touch signal linesTL11 to TL1 p, and touch driving signals may be applied to the firsttouch electrodes TE disposed on the first side and second side of thetouch sensor area TSA by using the first touch signal lines TL11 to TL1p and the second touch signal lines TL21 to TL2 p. Therefore, the touchdriving signals may be stably applied to the first touch electrodes TE.

FIG. 6 is an enlarged plan view showing an example of the area A of FIG.5 according to some embodiments. FIG. 7 is an example of across-sectional view taken along sectional line II-IP of FIG. 6according to some embodiments.

Referring to FIGS. 6 and 7 , a thin film transistor layer TFTL is formedon the first substrate SUB1. The thin film transistor layer TFTLincludes thin film transistors 120, a gate insulating film 130, aninterlayer insulating film 140, a protective film 150, and aplanarization film 160.

A buffer film BF may be formed on one surface of the first substrateSUB1. The buffer film BF may be formed on one surface of the firstsubstrate SUB1 so as to protect the thin film transistors 120 and anorganic light emitting layer 172 of the light emitting element layer EMLfrom moisture penetrating through the first substrate SUB1 that isvulnerable to moisture. The buffer film BF may be formed of a pluralityof alternately laminated inorganic films. For example, the buffer filmBF may be formed of a multi-layer film in which one or more inorganiclayers including one or more of a silicon oxide (SiOx), a siliconnitride (SiNx), and a silicon oxynitride (SiON) are alternatelylaminated. The buffer film BF may be omitted.

The thin film transistor 120 is formed on the buffer film BF. The thinfilm transistor 120 includes an active layer 121, a gate electrode 122,a source electrode 123, and a drain electrode 124. Although it is shownin FIG. 7 that the thin film transistor 120 is formed by (or in) a topgate manner in which the gate electrode 122 is located on the activelayer 121, it should be noted that embodiments are not limited thereto.For instance, the thin film transistor 120 may be formed by a bottomgate manner in which the gate electrode 122 is located beneath theactive layer 121, or may be formed by a double gate manner in which thegate electrode 122 is located both on and beneath the active layer 121.

The active layer 121 is formed on the buffer film BF. The active layer121 may be formed of an organic semiconductor, such as polycrystallinesilicon, monocrystalline silicon, low-temperature polycrystallinesilicon, or amorphous silicon, or an oxide semiconductor. A lightblocking layer (not shown) for blocking external light incident on theactive layer 121 may be formed between the buffer film BF and the activelayer 121.

The gate insulating film 130 may be formed on the active layer 121. Thegate insulating film 130 may be formed of an inorganic layer, forexample, a silicon nitride layer, a silicon oxynitride layer, a siliconoxide layer, a titanium oxide layer, or an aluminum oxide layer.

The gate electrode 122 and a gate line may be formed on the gateinsulating film 130. The gate electrode 122 and the gate line may beformed of a single layer or a multi-layer including at least one ofmolybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti),nickel (Ni), neodymium (Nd) and copper (Cu), and/or an alloy thereof.

The interlayer insulating film 140 may be formed on the gate electrode122 and the gate line. The interlayer insulating film 140 may be formedof an inorganic layer, for example, a silicon nitride layer, a siliconoxynitride layer, a silicon oxide layer, a titanium oxide layer, or analuminum oxide layer.

The source electrode 123 and the drain electrode 124 may be formed onthe interlayer insulating film 140. Each of the source electrode 123 andthe drain electrode 124 may be connected to the active layer 121 througha contact hole that penetrates the gate insulating film 130 and theinterlayer insulating film 140. The source electrode 123 and the drainelectrode 124 may be formed of a single layer or a multi-layer includingat least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold(Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu), and/oran alloy thereof.

The protective film 150 for insulating the thin film transistor 120 maybe formed on the source electrode 123 and the drain electrode 124. Theprotective film 150 may be formed of an inorganic layer, for example, asilicon nitride layer, a silicon oxynitride layer, a silicon oxidelayer, a titanium oxide layer, or an aluminum oxide layer.

The planarization film 160 for planarizing a step due to the thin filmtransistor 120 may be formed on the protective film 150. Theplanarization film 160 may be formed of an organic film including atleast one of an acryl resin, an epoxy resin, a phenolic resin, apolyamide resin, and a polyimide resin.

The light emitting element layer EML is formed on the thin filmtransistor layer TFTL. The light emitting element layer EML includeslight emitting elements 170 and a pixel defining film 180.

The light emitting elements 170 and the pixel defining film 180 areformed on the planarization film 160. Each of the light emittingelements 170 may include a first electrode 171, an organic lightemitting layer 172, and a second electrode 173.

The first electrode 171 may be formed on the planarization film 160. Thefirst electrode 171 may be connected to the source electrode 123 of thethin film transistor 120 through a contact hole that penetrates theprotective film 150 and the planarization film 160.

In a top emission structure in which light is emitted toward the secondelectrode 173 based on the organic light emitting layer 172, the firstelectrode 171 may be formed of a high-reflectance metal material, suchas a laminate structure of aluminum and titanium (Ti/Al/Ti), a laminatestructure of aluminum and indium tin oxide (ITO) (ITO/Al/ITO), an APCalloy, or a laminate structure of an APC alloy and ITO (ITO/APC/ITO).The APC alloy may be an alloy of at least one of silver (Ag), palladium(Pd), and copper alloy (Cu).

In a bottom emission structure in which light is emitted toward thefirst electrode 171 based on the organic light emitting layer 172, thefirst electrode 171 may be formed of a transparent conductive material(TCO), such as ITO or indium zinc oxide (IZO), which islight-transmissive, or a semi-transmissive conductive material, such asmagnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver(Ag). In this case, when the first electrode 171 is formed of a semitransmissive conductive material, light emission efficiency may beincreased by microcavities in the first electrode 171.

The pixel defining film 180 for defining pixels P may be formed on theplanarization film 160 to partition the first electrode 171. The pixeldefining film 180 may be formed to cover the edge of the first electrode171. The pixel defining film 180 may be formed of an organic layerincluding at least one of an acryl resin, an epoxy resin, a phenolicresin, a polyamide resin, and a polyimide resin.

Each of the pixels P refers to an area where the first electrode 171,the organic light emitting layer 172, and the second electrode 173 aresequentially laminated, and holes from the first electrode 171 andelectrons from the second electrode 173 are combined with each other inthe organic light emitting layer 172 to emit light.

The organic light emitting layer 172 is formed on the first electrode171 and the pixel defining film 180. The organic light emitting layer172 may include an organic material to emit light of a predeterminedcolor. For example, the organic light emitting layer 172 may include ahole transporting layer, an organic material layer, and an electrontransporting layer. In this case, the organic light emitting layer 172of a red pixel may emit red light, the organic light emitting layer 172of a green pixel may emit green light, and the organic light emittinglayer 172 of a blue pixel may emit blue light. Alternatively, theorganic light emitting layers 172 of pixels P may emit white light. Inthis case, the red pixel may further include a red color filter layer,the green pixel may further include a green color filter layer, and theblue pixel may further include a blue color filter layer.

The light emitting layer 172 may include a hole transporting layer, alight emitting layer, and an electron transporting layer. Further, thelight emitting layer 172 may be formed to have a tandem structure of twostacks or more, and in this case, a charge generating layer may beformed between the stacks.

The second electrode 173 is formed on the organic light emitting layer172. The second electrode 173 may be formed to cover the organic lightemitting layer 172. The second electrode 173 may be a common layerformed commonly in the pixels P. Although not shown, a capping layer maybe formed on the second electrode 173.

In a top emission structure, the second electrode 173 may be formed of atransparent conductive material (TCO), such as ITO or IZO, which islight-transmissive, or a semi-transmissive conductive material such asmagnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver(Ag). When the second electrode 173 is formed of a semi-transmissiveconductive material, light emission efficiency may be increased bymicrocavities in the second electrode 173.

In a bottom emission structure, the second electrode 173 may be formedof a high-reflectance metal material, such as a laminate structure ofaluminum and titanium (Ti/Al/Ti), a laminate structure of aluminum andITO (ITO/Al/ITO), an APC alloy, or a laminate structure of an APC alloyand ITO (ITO/APC/ITO). The APC alloy may be an alloy of at least one ofsilver (Ag), palladium (Pd), and copper alloy (Cu).

A second substrate SUB2 is disposed on the light emitting element layerEML, and a touch sensor layer TSL is formed on the second substrateSUB2. The touch sensor layer TSL includes first touch electrodes TE,second touch electrodes RE, connection electrodes CE, first touch signallines TL11 to TL1 p, second touch signal lines TL21 to TL2 p, thirdtouch signal lines RL1 to RLq, guard lines GL1, GL2, GL3, and GL4, andground lines GRL1 and GRL2. For convenience of explanation, FIGS. 6 and7 only illustrate the first touch electrodes TE, second touch electrodesRE, first touch island electrodes TEI disposed between first touchelectrodes TE, and connection electrodes CE.

The connection electrodes CE are formed on the second substrate SUB2.Each of the connection electrodes CE connects the first touch electrodeTE and the first touch island electrode TEI. One end of each of theconnection electrodes CE may be connected to the first touch electrodeTE, and the other end thereof may be connected to the first touch islandelectrode TEI.

Each of the connecting electrodes CE may be formed of an opaque metalconductive layer. For example, each of the connecting electrodes CE maybe formed of a single layer or multi-layer including at least one ofmolybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti),nickel (Ni), neodymium (Nd), and copper (Cu), and/or an alloy thereof.Thus, in order to prevent the aperture ratio of the pixel P, as shown inFIG. 7 , the connection electrodes CE may not overlap the pixels P, andmay overlap the pixel defining film 180.

A first insulating film 510 is formed on the connection electrodes CE.The first insulating film 510 may be formed of an inorganic layer, forexample, a silicon nitride layer, a silicon oxynitride layer, a siliconoxide layer, a titanium oxide layer, or an aluminum oxide layer.

First touch electrodes TE, first touch island electrodes TEI, and secondtouch electrodes RE are formed on the first insulating film 510. Thefirst touch electrode TE may be connected to the connection electrode CEthrough a first contact hole CNT1 that penetrates the first insulatingfilm 510 to expose the connection electrode CE. The first touch islandelectrode TEI may be connected to the connection electrode CE through asecond contact hole CNT2 that penetrates the first insulating film 510to expose the connection electrode CE. Thus, the first touch electrodeTE may be connected to the first touch island electrode TEI through theconnection electrode CE. Accordingly, the first touch electrodes TEarranged in the second direction (Y-axis direction) in each of theplurality of columns may be electrically connected to each other.

The first touch electrodes TE, the first touch island electrodes TEI,and the second touch electrodes RE may be formed of a transparent metaloxide (TCO) such as ITO or IZO, which can transmit light. Thus, evenwhen the first touch electrodes TE, the first touch island electrodesTEI, and the second touch electrodes RE overlap the pixels P, theaperture ratio of the pixel P may not deteriorate.

A second insulating film 520 is formed on the first touch electrodes TE,the first touch island electrodes TEI, and the second touch electrodesRE. The second insulating film 520 may be formed of an inorganic layer,for example, a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

FIG. 8 is an enlarged plan view showing an example of the area B of FIG.5 according to some embodiments. FIG. 9 is an enlarged plan view showingan example of the area B-1 of FIG. 8 according to some embodiments. FIG.10 is an example of a cross-sectional view taken along sectional lineIII-III′ and IV-IV′ of FIG. 9 according to some embodiments. FIG. 11 isan enlarged plan view showing another example of the area B-1 of FIG. 8according to some embodiments.

Referring to FIGS. 8, 9, and 10 , each of the 1-1 to 1-(p-1)th firsttouch signal lines TL11 to TL1(p-1) may include a first touch electrodeline TEL1, a first pad electrode PEL1, and a first connection line CL1.In contrast, since the 1-pth first touch signal line TL1 p does notintersect second touch signal lines TL21 to TL2 p, the 1-pth first touchsignal line TL1 p may not include the first touch electrode line TEL1,the first pad electrode PEL1, and the first connection line CL1.

In each of the 1-1 to 1-(p-1)th first touch signal lines TL11 toTL1(p-1), the length and width of the first connection line CL1 may besubstantially the same as each other. The length of the first connectionline CL1 may refer to a length of the first connection line CL1 in thesecond direction (Y-axis direction), and the width of the firstconnection line CL1 may refer to a length of the first connection lineCL1 in the first direction (X-axis direction).

The first touch electrode line TEL1 may be connected to the first touchelectrode TE disposed on the first side of the touch sensor area TSA.The first pad electrode line PEL1 may be connected to the touchelectrode pad TP of the touch pad area TDA. One end of the firstconnection line CL1 may be connected to the first touch electrode lineTEL1, and the other end of the first connection line CL1 may beconnected to the first pad electrode line PEL1.

The width of the first touch electrode line TEL1 may be substantiallythe same as the width of the first pad electrode line PEL1, and thewidth of the first connection line CL1 may be greater than the width ofthe first touch electrode line TEL1 and the width of the first padelectrode line PEL1.

The second touch signal lines TL21 to TL2 p may be branched from thefirst touch signal lines TL11 to TL1 p. For instance, the 2-1th secondtouch signal line TL21 may be branched from one end of the first touchelectrode line TEL1 of the 1-1th first touch signal line TL11, and the2-2th second touch signal line TL22 may be branched from one end of thefirst touch electrode line TEL1 of the 1-2th first touch signal lineTL12. Further, the 2-(p-1)th second touch signal line TL2(p-1) may bebranched from one end of the first touch electrode line TEL1 of the1-(p-1)th first touch signal line TL1(p-1), and the 2-pth second touchsignal line TL2 p may be branched from the 1-pth first touch signal lineTL1 p.

As shown in FIG. 10 , the first touch electrode line TEL1, the first padelectrode line PEL1, and the second touch signal lines TL21 to TL2 p maybe disposed on the second substrate SUB2. The first touch electrode lineTEL1, the first pad electrode line PEL1, and the second touch signallines TL21 to TL2 p may be disposed on the same layer as the connectionelectrode CE. Each of the first touch electrode line TEL1, the first padelectrode line PEL1, and the second touch signal lines TL21 to TL2 p maybe formed of a single layer or multi-layer including at least one ofmolybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti),nickel (Ni), neodymium (Nd), and copper (Cu), and/or an alloy thereof.

The first insulating film 510 may be disposed on the first touchelectrode line TEL1, the first pad electrode line PEL1, and the secondtouch signal lines TL21 to TL2 p, and the first connection line CL1 maybe disposed on the first insulating film 510. The first connection lineCL1 may be connected to the first touch electrode line TEL1 through athird contact hole CNT3 that penetrates the first insulating film 510 toexpose the first touch electrode line TEL1. Further, the firstconnection line CL1 may be connected to the first pad electrode linePEL1 through a fourth contact hole CNT4 that penetrates the firstinsulating film 510 to expose the first pad electrode line PEL1.Accordingly, the first touch electrode line TEL1 may be connected to thefirst pad electrode line PEL1 through the first connection line CL1.

The first connection line CL1 may be disposed on the same layer as thefirst touch electrodes TE and the second touch electrodes RE. The firstconnection line CL1 may be formed of a transparent metal oxide (TCO),such as ITO or IZO, that can transmit light.

Meanwhile, the 2-2 to 2-pth second touch signal lines TL22 to TL2 p mayoverlap the first connection lines CL1 of the 1-1 to 1-(p-1)th firsttouch signal lines TL11 to TL1(p-1) in the intersection regions of the1-1 to 1-(p-1)th first touch signal lines TL11 to TL1(p-1) and the 2-2to 2-pth second touch signal lines TL22 to TL2 p. As shown in FIG. 9 ,each of the 2-2 to 2-pth second touch signal lines TL22 to TL2 p mayinclude a bent portion TU overlapping the first connection line CL1.

The bent portions TU of the 2-2 to 2-pth second touch signal lines TL22to TL2p may have the same shape. The bent portion TU may include astructure that is bent at least once. For example, as shown in FIG. 9 ,the bent portion may be bent in a “₁ ” shape and then bent in a “ L”shape. The bent portion TU may be bent twice as shown in FIG. 9 , butthe number of bends of the bent portion TU is not limited thereto. Forexample, when the bent portion TU is bent once, it may be bent in theshape of “∧” or “∨.”

Alternatively, the 2-2 to 2-pth second touch signal lines TL22 to TL2 pmay include a plurality of bent portions overlapping the firstconnection line CL1, for example, a first bent portion TU1 and a secondbent portion TU2 as shown in FIG. 11 . Each of the first bent portionTU1 and the second bent portion TU2 may include a structure that is bentat least once.

The minimum distance between the first bent portion TU1 and the secondbent portion TU2 may be changed for each of the second touch signallines TL21 to TL2 p. The first bent portion TU1 and the second bentportion TU2 may be formed symmetrically with respect to each other. Forexample, the first bent portion TU1 may be bent in a ‘┘’ shape and thenbent in a ‘┌’ shape, whereas the second bent portion TU2 may be bent ina ‘┐’ shape and then bent in a ‘└’ shape.

Each of the 2-2 to 2-pth second touch signal lines TL22 to TL2 p has awidth W1 in the first direction (X-axis direction) in the bent portionTU greater than a width W2 in the second direction (Y-axis direction) ina region other than the bent portion TU. Further, the minimum distancebetween the bent portions TU of the second touch signal lines TL22 toTL2 p adjacent to each other is greater than the minimum distancebetween the second touch signal lines TL22 to TL2 p adjacent to eachother, e.g., the non-bent portions of the second touch signal lines TL22to TL2 p. For example, the minimum distance D1 between the bent portionTU of the 2-2th second touch signal line TL22 and the bent portion TU ofthe 2-3th second touch signal line TL23 is greater than the minimumdistance D2 between the 2-2th second touch signal line TL22 and the2-3th second touch signal line TL23.

As shown in FIGS. 8 and 9 , the density of the 2-2 to 2-pth second touchsignal lines TL22 to TL2 p is high in a region where the 2-2 to 2-pthsecond touch signal lines TL22 to TL2 p overlap the first connectionline CL1. The width and distance of each of the 2-2 to 2-pth secondtouch signal lines TL22 to TL2 p in the second direction (Y-axisdirection) may be smaller than 10 μm. The second touch signal lines TL21to TL2 p may be formed by a wet etching process. In this case, when thewidth and distance of each of the 2-2 to 2-pth second touch signal linesTL22 to TL2 p is smaller than 10 μm, the side surface of any one of thesecond touch signal lines TL21 to TL2 p, for example, the 2-2th secondtouch signal line TL22 may have a taper angle of approximately 90° evenwhen this side surface is formed in the shape of an inverse taper or aregular taper as shown in the cross-sectional view taken along sectionalline III-III′ as shown in FIG. 10 . In this case, due to the poor filmformation of the first insulating film 510 formed on the 2-2th secondtouch signal line TL22, the first connection line CL1 formed on thefirst insulating film 510 may be disconnected as shown in thecross-sectional view taken along selection line as shown in FIG. 10 .

However, each of the 2-2 to 2-pth second touch signal lines TL22 to TL2p includes a bent portion TU, and is formed to have a width W1 in thefirst direction (X-axis direction) in the bent portion TU greater than awidth W2 in the second direction (Y-axis direction) in a region otherthan the bent portion TU. Further, the distance between the second touchsignal lines TL22 to TL2 p adjacent to each other is formed to be largerin the bent portion TU than in the region other than the bent portionTU. For example, the width W1 of each of the 2-2 to 2-pth second touchsignal lines TL22 to TL2 p in the bent portion TU in the first direction(X-axis direction) and the minimum distance between the bent portions TUof the second touch signal lines TL22 to TL2 p adjacent to each othermay be 10 μm or more. Thus, in the bent portions TU of the 2-2 to 2-pthsecond touch signal lines TL22 to TL2 p, a regular taper having a taperangle of 70° or less may be formed as shown in the cross-sectional viewtaken along sectional line IV-IV′ as shown in FIG. 10 . Therefore, asshown in the cross-sectional view taken along sectional line IV-IV′ asshown in FIG. 10 , in the bent portions TU of the 2-2 to 2-pth secondtouch signal lines TL22 to TL2 p, the occurrence of poor film formationof the first insulating film 510 may be prevented, and thus, thedisconnection of the first connection line CL1 formed on the firstinsulating film 510 may be prevented. Accordingly, the first connectionline CL1 may be energized in the direction of the arrow in FIG. 9 .

FIG. 12 is an enlarged plan view showing an example of the area C ofFIG. 5 according to some embodiments.

Referring to FIG. 12 , each of the 2-2 to 2-(p-1)th second touch signallines TL22 to TL2(p-1) may include a second touch electrode line TEL2, athird touch electrode line TEL3, and a second connection line CL2. Incontrast, each of the 2-1th second touch signal line TL21 and the 2-pthsecond touch signal line TL2 p may not include a second touch electrodeline TEL2, a third touch electrode line TEL3, and a second connectionline CL2 because the 2-1th second touch signal line TL21 and the 2-pthsecond touch signal line TL2 p do not intersect the third connectionline CL3.

In each of the 2-2 to 2-(p-1)th second touch signal lines TL22 toTL2(p-1), the length and width of the second connection line CL2 may besubstantially the same as each other. The length of the secondconnection line CL2 may refer to a length of the second connection lineCL2 in the second direction (Y-axis direction), and the width of thesecond connection line CL2 may refer to a length of the secondconnection line CL2 in the first direction (X-axis direction).

The second touch electrode line TEL2 may be connected to any one of thefirst touch signal lines TL11 to TL1 p. The third touch electrode lineTEL3 may be connected to the first touch electrode TE disposed on thefirst side of the touch sensor area TSA. One end of the secondconnection line CL2 may be connected to the second touch electrode lineTEL2, and the other end thereof may be connected to the third touchelectrode line TEL3.

The width of the second touch electrode line TEL2 may be substantiallythe same as the width of the third touch electrode line TEL3, and thewidth of the second connection line CL2 may be greater than the width ofthe second touch electrode line TEL2 and the width of the third touchelectrode line TEL3.

The third connection line CL3 may connect the second touch electrode REof the second touch sensor area TSA2 to the second touch electrode RE ofthe third touch sensor area TSA3.

The second touch electrode line TEL2, the third touch electrode lineTEL3, and the third connection line CL3 may be disposed on the samelayer as the connection electrode CE. Each of the second touch electrodeline TEL2, the third touch electrode line TEL3, and the third connectionline CL3 may be formed of an opaque metal conductive layer, for example,a single layer or multi-layer including at least one of molybdenum (Mo),aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni),neodymium (Nd), and copper (Cu), and/or an alloy thereof.

The first insulating film 510 may be disposed on the second touchelectrode line TEL2, the third touch electrode line TEL3, and the thirdconnection line CL3, and the second connection line CL2 may be disposedon the first insulating film 510. The second connection line CL2 may beconnected to the second touch electrode line TEL2 through a fifthcontact hole CNTS that penetrates the first insulating film 510 toexpose the second touch electrode line TEL2. Further, the secondconnection line CL2 may be connected to the third touch electrode lineTEL3 through a sixth contact hole CNT6 that penetrates the firstinsulating film 510 and expose the third touch electrode line TEL3.

The second connection line CL2 may be disposed on the same layer as thefirst touch electrodes TE and the second touch electrodes RE. The secondconnection line CL2 may be formed of a transparent metal oxide (TCO),such as ITO or IZO, that can transmit light.

According to some embodiments, only one third connection line CL3 isformed in the intersection regions of the 2-2 to 2-(p-1)th second touchsignal lines TL22 to TL2(p-1) and the third connection line CL3.Therefore, the minimum distance between the third connection line CL3and the second touch electrode line TEL2 and the minimum distancebetween the third connection line CL3 and the third touch electrode lineTEL3 may be maintained 10 μm or more. Accordingly, the probability ofoccurrence of poor film formation of the first insulating film 510 onthe third connection line CL3 is low, and thus, the possibility ofdisconnection of the second connection line CL2 formed on the firstinsulating film 510 is also low. Nevertheless, to minimize thepossibility of disconnection of the second connection line CL2 due tothe poor film formation of the first insulating film 510, as describedwith reference to FIGS. 9 and 11 , the third connection line CL3 mayinclude at least one bent portion TU overlapping the second connectionline CL2.

FIG. 13 is an enlarged plan view showing an example of the area D ofFIG. 5 according to some embodiments. FIG. 14 is an enlarged plan viewshowing an example of the area E of FIG. 5 according to someembodiments. FIG. 15 is an enlarged plan view showing an example of thearea F of FIG. 5 according to some embodiments. FIG. 16 is an example ofa cross-sectional view taken along sectional line V-V′ of FIG. 13 ,sectional line VI-VI′ of FIG. 14 , and sectional line VII-VII′ of FIG.15 according to some embodiments.

FIGS. 13 and 14 show an example where third touch signal lines RL1 toRLq are disposed on the right outside of the touch sensor area TSA. FIG.13 shows 3-1 to 3-qth third touch signal lines RL1 to RLq, and FIG. 14shows 3-(q-1) and 3-qth third touch signal lines RLq-1 and RLq. FIG. 15shows an example where second touch signal lines TL21 to TL2 p aredisposed on the left outside of the touch sensor area TSA. The area D isdisposed closer to the touch pad area TDA than the area E.

Referring to FIGS. 13 and 14 , the 3-1th third touch signal line RL1 iselectrically connected to the second touch electrodes RE disposed in thefirst row. The 3-2th third touch signal line RL2 is electricallyconnected to the second touch electrodes RE disposed in the second row.The 3-(q-1)th third touch signal line RLq-1 is electrically connected tothe second touch electrodes RE disposed in the q-1th row. The 3-qththird touch signal line RLq is electrically connected to the secondtouch electrodes RE disposed in the q-th row. Accordingly, the length ofwiring increases from the 3-1th third touch signal line RL1 to the 3-qththird touch signal line RLq, and thus, the wiring resistances of thethird touch signal lines RL1 to RLq may be different from each other. Tominimize a difference between the wiring resistances of the third touchsignal lines RL1 to RLq, the wiring widths of the third touch signallines RL1 to RLq may be designed to be extended as the number of thethird touch signal lines RL1 to RLq decreases.

For example, as shown in FIG. 13 , each of the 3-1 to 3-qth third touchsignal lines RL1 to RLq has a third width W3. Since the 3-1th thirdtouch signal line RL1 is electrically connected to the second touchelectrodes RE disposed in the first row, the 3-1th third touch signalline RL1 is not disposed in the second row. Further, each of the 3-2 to3-qth third touch signal lines RL2 to RLq may have a fourth width W4that is greater than the third width W3.

According to some embodiments, the third width W3 corresponding to thewidth of each of the 3-1 to 3-qth third touch signal lines RL1 to RLqmay be narrower than the second width W2 of each of the 2-2 to 2-pthsecond touch signal lines TL22 to TL2 p in a region other than the bentportion TU. Further, the minimum distance D3 between the adjacent thirdtouch signal lines RL1 to RLq disposed in the first row may be smallerthan the minimum distance D2 between the adjacent second touch signallines TL22 to TL2 p in the first row. That is, the third touch signallines RL1 to RLq disposed in the first row may be arranged at higherdensity than the 2-2 to 2-pth second touch signal lines TL22 to TL2 poverlapping the first connection line CL1.

Further, as shown in FIG. 14 , each of the 3-(q-1)th third touch signalline RLq-1 and the 3-qth third touch signal line RLq disposed in theq-lth row have a fifth width W5. Since the 3-(q-1)th third touch signalline RLq-1 is electrically connected to the second touch electrodes REdisposed in the q-lth row, the 3-(q-1)th third touch signal line RLq-1is not disposed in the q-1th row. Accordingly, each of the 3-qth thirdtouch signal lines RLq disposed in the qth row may have a sixth widthW6. The sixth width W6 may be greater than the first to fifth widths W1to W5.

Referring to FIGS. 15 and 16 , the widths W7 of the second touch signallines TL21 to TL2p disposed on the left outside of the touch sensor areaTSA may be substantially the same as each other. The seventh width W7may be greater than the first width W1 and the third width W3, and maybe smaller than the sixth width W6.

The third touch signal lines RL1 to RLq disposed on the right outside ofthe touch sensor area TSA and the second touch signal lines TL21 to TL2p disposed on the left outside of the touch sensor area TSA may bedisposed on the same layer as the connection electrode CE as shown inFIG. 16 . Each of the third touch signal lines RL1 to RLq disposed onthe right outside of the touch sensor area TSA and the second touchsignal lines TL21 to TL2 p disposed on the left outside of the touchsensor area TSA may be formed of an opaque metal conductive layer, forexample, a single layer or multi-layer including at least one ofmolybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti),nickel (Ni), neodymium (Nd), and copper (Cu), and/or an alloy thereof.

FIG. 17 is another example of a cross-sectional view taken alongsectional line II-II′ of FIG. 6 according to some embodiments. FIG. 18is an enlarged plan view showing another example of the area B-1 of FIG.8 according to some embodiments. FIG. 19 is an example of across-sectional view taken along sectional line VIII-VIII′ of FIG. 18according to some embodiments.

The embodiments described in association with FIGS. 17, 18, and 19 aredifferent from the embodiments described in association with FIGS. 7, 9,and 10 in that the first touch electrodes TE, the first touch islandelectrodes TEI, the second touch electrodes RE, and the first connectionline CL1 are arranged on the second substrate SUB2, and the connectionelectrodes CE, the first touch electrode line TEL1, the first padelectrode line PEL1, and the second touch signal lines TL21 to TL2 p arearranged on the first touch electrodes TE, the first touch islandelectrodes TEI, the second touch electrodes RE, and the first connectionline CL1. Therefore, in FIGS. 17, 18, and 19 , a description overlappingthat of the embodiments described in association with FIGS. 7, 9, and 10will be omitted.

Referring to FIGS. 17, 18, and 19 , first touch electrodes TE, firsttouch island electrodes TEI, second touch electrodes RE, and a firstconnection line CL1 are formed on the second substrate SUB2. The firsttouch electrodes TE, the first touch island electrodes TEI, the secondtouch electrodes RE, and the first connection line CL1 may be formed ofa transparent metal oxide (TCO), such as ITO or IZO, which can transmitlight. Thus, even when the first touch electrodes TE, the first touchisland electrodes TEI, and the second touch electrodes RE overlap thepixels P, the aperture ratio of the pixels P may not deteriorate.

A first insulating film 510 is formed on the first touch electrodes TE,the first touch island electrodes TEI, the second touch electrodes RE,and the first connection line CL1.

Connection electrodes CE, first touch electrode line TEL1, a first touchelectrode line TEL1, a first pad electrode line PEL1, and second touchsignal lines TL21 to TL2 p are disposed on the first insulating film510. Each of the connection electrodes CE, first touch electrode lineTEL1, a first touch electrode line TEL1, a first pad electrode linePEL1, and second touch signal lines TL21 to TL2 p may be formed of anopaque metal conductive layer, for example, a single layer ormulti-layer including at least one of molybdenum (Mo), aluminum (Al),chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd),and copper (Cu), and/or an alloy thereof. Thus, to prevent the apertureratio of the pixels P from decreasing, as shown in FIG. 17 , theconnection electrodes CE may not overlap the pixels P, and may overlapthe pixel defining film 180.

The connection electrode CE may be connected to the first touchelectrode TE through a first contact hole CNT1 that penetrates the firstinsulating film 510 to expose the first touch electrode TE. Theconnection electrode CE may be connected to the first touch islandelectrode TE1 through a second contact hole CNT2 that penetrates thefirst insulating film 510 to expose the first touch island electrodeTE1. Thus, the first touch electrode TE may be connected to the firsttouch island electrode TEI through the connection electrode CE.Accordingly, the first touch electrodes TE arranged in the seconddirection (Y-axis direction) in each of the plurality of columns may beelectrically connected to each other.

The first touch electrode line TEL1 may be connected to the firstconnection line CL1 through a third contact hole CNT3 that penetratesthe first insulating film 510 to expose the first connection line CL1.Further, the first pad electrode line PEL1 may be connected to the firstconnection line CL1 through a fourth contact hole CNT4 that penetratesthe first insulating film 510 to expose the first connection line CL1.As such, the first touch electrode line TEL1 may be connected to thefirst pad electrode line PEL1 through the first connection line CL1.

The second touch signal lines TL21 to TL2 p are disposed on the firstconnection line CL1 in a region where the first connection line CL1overlaps the second touch signal lines TL22 to TL2 p. When the width anddistance of each of the second touch signal lines TL22 to TL2 p issmaller than 10 μm, the side surface of any one of the second touchsignal lines TL21 to TL2 p, for example, the 2-2th second touch signalline TL22 may be formed in an inverse taper. In this case, the poor filmformation of the first insulating film 510 formed on the 2-2th secondtouch signal line TL22 may occur. However, as shown in FIG. 19 , sincethe first connection line CL1 is disposed under the 2-2th second touchsignal line TL22, the tapered shape of the side surface of the 2-2thsecond touch signal line TL22 is not related to the poor film formationof the second insulating film 520. Therefore, the first touch electrodeline TEL1 may be stably connected to the first pad electrode line PEL1through the first connection line CL1.

A second insulating film 520 is formed on the connection electrodes CE,the first touch electrode line TEL1, the first pad electrode line PEL1,and the second touch signal lines TL21 to TL2 p.

According to some embodiments, similarly to the area C, the secondconnection line CL2 of each of the 2-2 to 2-(p-1)th second touch signallines TL22 to TL2(p-1) may be disposed under the second touch electrodeline TEL2, the third touch electrode line TEL3, and the third connectionline CL3. Since this configuration is similar to those having beendescribed with reference to FIGS. 17, 18, and 19 , a detaileddescription thereof will be omitted.

FIG. 20 is another example of a cross-sectional view taken alongsectional line V-V′ of FIG. 13 , sectional line VI-VI′ of FIG. 14 , andsectional line VII-VII′ of FIG. 15 according to some embodiments.

The embodiments described in association with FIG. 20 are different fromthe embodiments described in association with FIG. 16 in that each ofthe third touch signal lines RL to RLq disposed on the right outside ofthe touch sensor area TSA and the second touch signal lines TL21 to TL2p disposed on the left outside the touch sensor area TSA is formed of aplurality of layers. Therefore, in association with FIG. 20 , adescription overlapping that of the embodiments described in associationwith FIG. 16 will be omitted.

Referring to FIG. 20 , each of the third touch signal lines RL1 to RLqmay include a first touch signal layer TSL1 and a second touch signallayer TSL2. Each of the second touch signal lines TL21 to TL2 p mayinclude a third touch signal layer TSL3 and a fourth touch signal layerTSL4.

The first touch signal layer TSL1 and the third touch signal layer TSL3may disposed on the second substrate SUB2, and a first insulating film510 may be disposed on the first touch signal layer TSL1 and the thirdtouch signal layer TSL3. In this case, the first touch signal layer TSL1and the third touch signal layer TSL3 may be disposed on the same layeras the first touch electrodes TE, the first touch island electrode TEI,the second touch electrodes RE, and the first connection line CL1, whichare shown in FIGS. 17, 18, and 19 . The first touch signal layer TSL1and the third touch signal layer TSL3 may be formed of a transparentmetal oxide (TCO), such as ITO or IZO, that can transmit light.

The second touch signal layer TSL2 and the fourth touch signal layerTSL4 may be disposed on the first insulating film 510, and the secondinsulating film 520 may be disposed on the second touch signal layerTSL2 and the fourth touch signal layer TSL4. In this case, the secondtouch signal layer TSL2 and the fourth touch signal layer TSL4 may bedisposed on the same layer as the connection electrodes CE, the firsttouch electrode line TEL1, the first pad electrode line PEL1, and thesecond touch signal lines TL21 to TL2 p, which are shown in FIGS. 17,18, and 19 . Each of the second touch signal layer TSL2 and the fourthtouch signal layer TSL4 may be formed of an opaque metal conductivelayer, for example, a single layer or multi-layer including at least oneof molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium(Ti), nickel (Ni), neodymium (Nd), and copper (Cu), and/or an alloythereof.

According to some embodiments, when the width W8 of the first touchsignal layer TSL1 is larger than the width W9 of the second touch signallayer TSL2, a short circuit may occur between the third touch signallines RL1 to RLq adjacent to each other. However, when the first touchsignal layer TSL1 is formed of a transparent metal oxide, it isdifficult to inspect the occurrence of a short circuit. Therefore, thewidth W8 of the first touch signal layer TSL1 may be made smaller thanthe width W9 of the second touch signal layer TSL2. For a similarreason, the width W10 of the third touch signal layer TSL3 may be madesmaller than the width W11 of the fourth touch signal layer TSL4.

As shown in FIGS. 13 and 14 , for uniform resistance design, the thirdtouch signal lines RL1 to RLq may be designed by extending the wiringwidths (e.g., in the X-axis direction) of the third touch signal linesRL1 to RLq as the number of the third touch signal lines RL1 to RLqdecreases. In this case, both the wiring width of the first touch signallayer TSL1 and the wiring width of the second touch signal layer TSL2 ofeach of the third touch signal lines RL1 to RLq can be extended.Alternatively, only the wiring width of the second touch signal layerTSL2 of each of the third touch signal lines RL1 to RLq may be extended.In this case, the first touch signal layer TSL1 of each of the thirdtouch signal lines RL1 to RLq may have the same width regardless of theextension of the wiring width.

As shown in FIG. 20 , the second touch signal layer TSL2 may beconnected to the first touch signal layer TSL1 through a contact holepenetrating the first insulating film 510. The fourth touch signal layerTSL4 may be connected to the third touch signal layer TSL3 through acontact hole penetrating the first insulating film 510. When the touchsensing unit 500 is cut by a scribing process in a touch mother board(or substrate), the first insulating film 510 and the second insulatingfilm 520 may be opened by fragments of the second substrate SUB2 of thetouch sensing unit 500. Thus, some of the third touch signal lines RL1to RLq, first guard line GL1 and first ground line GRL1 disposed on theright outside of the touch sensor area TSA, and some of the second touchsignal lines TL21 to TL2 p, fourth guard line GL4 and second ground lineGRL2 disposed on the left outside of the touch sensor area TSA may beexposed without being covered by the first insulating film 510 and thesecond insulating film 520. In this case, since the exposed lines may beoxidized, some of the second touch electrodes RE of the touch sensingunit 500 may not be able to be driven.

However, according to some embodiments described in association withFIG. 20 , the second touch signal lines TL21 to TL2 p and the thirdtouch signal lines RL1 to RLq are formed in a double structure of atransparent conductive oxide layer and an opaque metal conductive layer.Therefore, even if the opaque metal conductive layer is exposed withoutbeing covered by the second insulating film 520 because the secondinsulating film 520 is opened by the fragment of the second substrateSUB2, conductivity may be maintained by the transparent conductive oxidelayer. Therefore, it is possible to prevent some of the second touchelectrodes RE of the touch sensing unit 500 from being disabled and notable to be driven.

FIG. 21 is a plan view showing an example of the touch sensing unit ofFIG. 5 according to some embodiments.

The embodiments described in association with FIG. 21 are different fromthe embodiments described in association with FIG. 5 in that the secondtouch signal lines TL21 to TL2 p are not branched from the first touchsignal lines TL11 to TL1 p. As such, a description overlapping that ofthe embodiments of FIG. 5 will be omitted.

Referring to FIG. 21 , the second touch signal lines TL21 to TL2 p maybe connected to the touch electrode pads TP of the touch pad area TDA.The second touch signal lines TL21 to TL2 p may not intersect the firsttouch signal lines TL11 to TL1 p. Therefore, the first touch signallines TL11 to T11 p and the second touch signal lines TL21 to TL2 p maybe disposed on the same layer as the connection electrodes CE.

Since the areas A, C, D, E, and F shown in FIG. 21 are substantially thesame as those described in FIGS. 6, 7, 12 to 17, and 20 , a detaileddescription thereof will be omitted.

FIG. 22 is a plan view showing another example of the touch sensing unitof FIG. 5 according to some embodiments.

The embodiments described in association with FIG. 22 are different fromthe embodiments described in association with FIG. 5 in that the touchsensor area TSA does not include the second touch sensor area TSA2protruding from one side of the first touch sensor area TSA1 and thethird touch sensor area TSA3 protruding from the other side of the firsttouch sensor area TSA1. Therefore, a description overlapping that of theembodiments described in association with FIG. 5 will be omitted.

Referring to FIG. 22 , the touch sensor area TSA may not include thesecond touch sensor area TSA2 protruding from one side of the firsttouch sensor area TSA1, and the third touch sensor area TSA3 protrudingfrom the other side of the first touch sensor area TSA1. As such, thetouch sensor area TSA may not include a recessed area RA having a shapein which the center of one side thereof is recessed, and the touchsensing unit 500 may not include a third connection line CL3 forconnecting the second touch electrode RE of the second touch sensor areaTSA2 to the second touch electrode RE of the third touch sensor areaTSA3.

Since the areas A, B, D, E, and F shown in FIG. 22 are substantially thesame as those described in association with FIGS. 6 to 11 and 13 to 20 ,a detailed description thereof will be omitted.

FIG. 23 is a plan view showing another example of the touch sensing unitof FIG. 5 according to some embodiments.

The embodiments described in association with FIG. 23 is different fromthe embodiments described in association with FIG. 5 in that that thesecond touch signal lines TL21 to TL2 p are not branched from the firsttouch signal lines TL11 to TL1 p, and in that the touch sensor area TSAdoes not include the second touch sensor area TSA2 protruding from oneside of the first touch sensor area TSA1, and the third touch sensorarea TSA3 protruding from the other side of the first touch sensor areaTSA1. Therefore, a description overlapping the embodiments described inassociation with FIG. 5 will be omitted.

Referring to FIG. 23 , the second touch signal lines TL21 to TL2 p maybe connected to the touch electrode pads TP of the touch pad area TDA.The second touch signal lines TL21 to TL2 p may not intersect the firsttouch signal lines TL11 to TL1 p. Therefore, the first touch signallines TL11 to T11 p and the second touch signal lines TL21 to TL2 p maybe disposed on the same layer as the connection electrodes CE.

Further, the touch sensor area TSA may not include the second touchsensor area TSA2 protruding from one side of the first touch sensor areaTSA1, and the third touch sensor area TSA3 protruding from the otherside of the first touch sensor area TSA1. Thus, the touch sensor areaTSA may not include a recessed area RA having a shape in which thecenter of one side thereof is recessed, and the touch sensing unit 500may not include a third connection line CL3 for connecting the secondtouch electrode RE of the second touch sensor area TSA2 to the secondtouch electrode RE of the third touch sensor area TSA3.

Since the areas A, D, E, and F shown in FIG. 23 are substantially thesame as those described in FIGS. 6, 7, 11 and 17, and 20 , a detaileddescription thereof will be omitted.

FIG. 24 is a perspective view of another display device according tosome embodiments. FIG. 25 is a plan view of another display deviceaccording to some embodiments.

The embodiments described in association with FIGS. 24 and 25 aredifferent from the embodiments described in association with FIGS. 1 and2 in that a display panel 100 includes a main area MA and a protrusionarea PA protruding from the main area MA. Therefore, a descriptionoverlapping that of the embodiments described in association with FIGS.1 and 2 will be omitted.

Referring to FIGS. 24 and 25 , a display device 10 according to someembodiments includes a display panel 100, a display driving circuit 200,a display circuit board 300, and a touch driving circuit 400.

The display panel 100 includes a main area MA and a protrusion area PAprotruding from one side of the main area MA.

The main area MA may have a rectangular planar shape having short sidesin the first direction (X-axis direction) and long sides in the seconddirection (Y-axis direction). The corner where the short side in thefirst direction (X-axis direction) meets the long side in the seconddirection (Y-axis direction) may be formed to have a round shape of apredetermined curvature or have a right angle shape, or some othergeometric configuration. The planar shape of the display panel 100 isnot limited to a rectangular shape, and may be formed in anotherpolygonal shape, circular shape, or elliptical shape. The main area MAmay be formed flat, but is not limited thereto, and may include a curvedportion formed at, for instance, left and right ends. In this case, thecurved portion may have a constant curvature or a variable curvature.

The main area MA may include a display area DA where pixels are formedto display an image, and a non-display area NDA, which is outside (e.g.,a peripheral area) of the display area DA.

In the display area DA, not only pixels but also scan lines, data lines,and power supply lines, which are connected to the pixels, may bearranged. When the main area MA includes the curved portion, the displayarea DA may be disposed in the curved portion. In this case, the imageof the display panel 100 may also be seen even on the curved portion.

The non-display area NDA may be defined as an area from the outside ofthe display area DA to the edge of the display panel 100. In thenon-display area NDA, a scan driving unit for applying scan signals toscan lines and link lines for connecting data lines to the displaydriving circuit 200 may be arranged.

The protrusion area PA may protrude from one side of the main area MA.For example, the protrusion area PA may protrude from the lower side ofthe main area MA as shown in FIGS. 24 and 25 . The length of theprotrusion area PA in the second direction (Y-axis direction) may beshorter than the length of the main area MA in the first direction(X-axis direction), or vice versa.

The protrusion area PA may include a bending area BA and a pad area PDA.In this case, the pad area PDA may be disposed at one side of thebending area BA, and the main area MA may be disposed at the other sideof the bending area BA. For example, the pad area PDA may be disposed atthe lower side of the bending area BA, and the main area MA may bedisposed at the upper side of the bending area BA.

The display panel 100 may be formed to be flexible such that it is (orcan be) intentionally bent, unbent, warped, unwarped, folded, unfolded,rolled, and/or unrolled. As such, the display panel 100 may be bent fromthe bending area BA in the thickness direction (Z-axis direction). Inthis case, one side of the pad area PDA of the display panel 100 facesupward before the display panel 100 is bent, but one side of the padarea PDA of the display panel 100 faces downward after the display panel100 is bent. Thus, since the pad area PDA is disposed under the mainarea MA, the pad area PDA may overlap the main area MA.

The pad area PDA of the display panel 100 may be provided with padselectrically connected to the display driving circuit 200 and thedisplay circuit board 300. The pads may include display padselectrically connected to the display driving circuit 200 and touch padselectrically connected to touch lines.

The touch driving circuit 400 may be disposed on the display circuitboard 300. The touch driving circuit 400 may be formed of an integratedcircuit (IC) and mounted on the display circuit board 300.

FIG. 26 is an example of a cross-sectional view taken along sectionalline IX-IX′ of FIG. 25 according to some embodiments.

The embodiments described in association with FIG. 26 are different fromthe embodiments described in association with FIG. 3 in that the secondsubstrate SUB2 is emitted, and the touch sensor layer TSL is disposed ona thin film encapsulation layer TFEL. Therefore, a descriptionoverlapping that of the embodiments described in association with FIG. 3will be omitted.

Referring to FIG. 26 , the thin film encapsulation layer TFEL may bedisposed in both the display area DA and the non-display area NDA. Forinstance, the thin film encapsulation layer TFEL may be disposed so asto cover the thin film transistor layer TFTL and the light emittingelement layer EML in the display area DA and the non-display area NDA.

A touch sensor layer TSL may be disposed on the thin film encapsulationlayer TFEL. Since the touch sensor layer TSL may be disposed directly onsuch that the touch sensor layer TSL contacts the thin filmencapsulation layer TFEL, there is an advantage that the thickness ofthe display device 10 can be reduced compared to when a separate touchpanel including the touch sensor layer TSL is disposed on the thin filmencapsulation layer TFEL.

FIG. 27 is a plan view showing an example of the display unit of FIG. 26according to some embodiments. FIG. 28 is a plan view showing an exampleof the touch sensing unit of FIG. 26 according to some embodiments.

The embodiments described in association with FIGS. 27 and 28 aredifferent from the embodiments described in association with FIGS. 4 and5 in that display electrode pads DP and touch electrode pads TP1 and TP2are disposed in the pad area PDA of the protrusion area PA of thedisplay panel 100, and touch electrodes TE and RE are formed in a meshshape. Also, the touch sensor area TSA does not include the second touchsensor area TSA2 protruding from one side of the first touch sensor areaTSA1 and the third touch sensor area TSA3 protruding from the other sideof the first touch sensor area TSA1. In this manner, the touch sensorarea TSA may not include a recessed area RA having a shape in which thecenter of one side thereof is recessed, and the touch sensing layer TSLmay not include a third connection line CL3 for connecting the secondtouch electrode RE of the second touch sensor area TSA2 to the secondtouch electrode RE of the third touch sensor area TSA3. Thus, adescription overlapping that of the embodiments described in associationwith FIGS. 4 and 5 will be omitted.

Referring to FIGS. 27 and 28 , the display electrode pads DP may bedisposed at one end of the protrusion area PA of the display panel 100.The first touch electrode pads TP1 may be disposed at the left side ofthe display electrode pads DP, and the second touch electrode pads TP2may be disposed at the right side of the display electrode pads DP.

The driving electrodes TE and the sensing electrodes RE may be formed asmesh-shaped electrodes as shown in FIG. 28 . When the touch sensor layerTSL including the driving electrodes TE and the sensing electrodes RE isformed directly on the thin film encapsulation layer TFEL as shown inFIG. 26 , since the distance between the second electrode of the lightemitting element layer EML and the driving electrodes TE or sensingelectrodes RE of the touch sensor layer TSL is close, a parasiticcapacitance may be formed greatly between the second electrode of thelight emitting element layer EML and the driving electrode TE or sensingelectrode RE of the touch sensor layer TSL. Therefore, to reduce theparasitic capacitance, the driving electrodes TE and the sensingelectrodes RE may be formed as mesh-shaped electrodes as shown in FIG.28 , rather than being formed as non-patterned electrodes of atransparent oxide conductive layer, such as ITO or IZO.

Since the areas B, D, E, and F shown in FIG. 28 are substantially thesame as those described in association with FIGS. 8, 9, 13 to 17, and 20, a detailed description thereof will be omitted.

According to various embodiments, a touch sensing unit and a displaydevice including the same may include second touch signal lines branchedfrom first touch signal lines, and touch driving signals can be appliedto the first touch electrodes disposed at first and second sides of thetouch sensor area using the first touch signal lines and the secondtouch signal lines. Therefore, the touch driving signals can be stablyapplied to the first touch electrodes.

Further, according to various embodiments, a touch sensing unit and adisplay device including the same may include the touch signal linesformed to have a double structure of a transparent conductive oxidelayer and an opaque metal conductive layer. As such, even if the opaquemetal conductive layer is exposed without being covered by a secondinsulating film because the second insulating film is opened by afragment of the second substrate when a scribing process is performed,conductivity may be maintained by the transparent conductive oxidelayer. Therefore, it is possible to prevent some of the second touchelectrodes RE of the touch sensing unit from being disabled from beingdriven.

It is noted, however, that the effects of the inventive concepts are notlimited by the foregoing, and other various effects are anticipatedherein.

Although certain embodiments and implementations have been describedherein, other embodiments and modifications will be apparent from thisdescription. Accordingly, the inventive concepts are not limited to suchembodiments, but rather to the broader scope of the accompanying claimsand various obvious modifications and equivalent arrangements as wouldbe apparent to one of ordinary skill in the art.

1-8. (canceled)
 9. A touch sensing unit, comprising: first touchelectrodes and second touch electrodes disposed in a first touch sensorarea, a second touch sensor area protruding from one side of the firsttouch sensor area in a first direction, and a third touch sensor areaprotruding from the one side of the first touch sensor area in the firstdirection; a first touch signal line electrically connected to the firsttouch electrodes arranged in a first column in the first touch sensorarea; a second touch signal line electrically connected to the firsttouch electrodes arranged in the first column in the first touch sensorarea; and a first connection line connected to a second touch electrodeof the second touch sensor area and a second touch electrode of thethird touch sensor area, wherein the first connection line intersectsthe second touch signal line in an area between the second touch sensorarea and the third touch sensor area.
 10. The touch sensing unit ofclaim 9, wherein the second touch signal line comprises: a secondconnection line overlapping the first connection line, the secondconnection line comprising a first end and a second end opposing thefirst end; a first touch electrode line connected to the first end; anda second touch electrode line connected to the second end.
 11. The touchsensing unit of claim 10, wherein the first connection line, the firsttouch electrode line, and the second touch electrode line are disposedin a same layer as one another.
 12. The touch sensing unit of claim 10,wherein the first connection line, the first touch electrode line, andthe second touch electrode line are disposed in a different layer thanthe second connection line.
 13. The touch sensing unit of claim 10,wherein the first touch electrodes, the second touch electrodes, and thesecond connection line are disposed in a same layer as one another. 14.The touch sensing unit of claim 10, further comprising: a substrate onwhich the first touch signal line, the first touch electrode line, thesecond touch electrode line, and the first connection line are disposed;and a first insulating film disposed on the first touch signal line, thefirst touch electrode line, the second touch electrode line, and thefirst connection line, wherein the first touch electrodes, the secondtouch electrodes, and the second connection line are disposed on thefirst insulating film.
 15. The touch sensing unit of claim 14, wherein:the first end of the second connection line is connected to the firsttouch electrode line through a first contact hole; and the second end ofthe second connection line is connected to the second touch electrodethrough the first contact hole.
 16. The touch sensing unit of claim 10,further comprising: a third touch signal line electrically connected tothe first touch electrodes arranged in a second column different fromthe first column, wherein the second touch signal line intersects thethird touch signal line in a touch peripheral area.
 17. The touchsensing unit of claim 16, wherein the second touch signal linecomprises: a bent portion bent at least once in an intersection regionof the second touch signal line and the third touch signal line.
 18. Thetouch sensing unit of claim 16, wherein: the third touch signal linecomprises: a third connection line overlapping the bent portion, thethird connection line comprising a first end and a second end opposingthe first end; a third touch electrode line connected to the first end;and a pad electrode line connected to the second end; and wherein thethird touch electrode line and the pad electrode line are disposed in adifferent layer than the third connection line.
 19. The touch sensingunit of claim 18, wherein: the third touch electrode line and the padelectrode line are disposed in a same layer as the first connectionline; and the third connection line is disposed in a same layer as thesecond connection line.
 20. The touch sensing unit of claim 10, whereineach of the first touch electrodes, the second touch electrodes, and thesecond connection line comprises a transparent conductive material. 21.The touch sensing unit of claim 9, wherein an area of the first touchsensor area is larger than an area of the second touch sensor area or anarea of the third touch sensor area.